Foundry technology for capacitive inertial MEMS sensors on SOI - MAGELAN

Standard inertial MEMS technology for faster time to market

Standard foundry technology for single-axis and multi-axis inertial MEMS accelerometers, gyros and vibration sensors


Tronics Microsystems proposes Magelan, its core inertial sensor technology, as an open MEMS foundry platform with design kit for customer specific design. This thick SOI technology with Vacuum/Hermetic WLP enables the production of industrial, automotive and aerospace-grade capacitive MEMS inertial sensor dies (accelerometers, vibration sensors, gyros) and brings the following benefits:

  • From single-axis to multi-axis capacitive MEMS designs
  • High sensitivity and high signal-to-noise
  • High reliability thanks to C-SOI and Hermetic Wafer Level Package with getter
  • Small die size and low cost
  • Ease of integration with standard wire-bonding

Inertial foundry technology with C-SOI and Hermetic/Vacuum Wafer Level Packaging

Magelan MEMS on SOI foundry technology

Magelan cross section

Reliability of vacuum WLP with getter

Long term reliability of vacuum WLP

DRIE on thick SOI and vacuum WLP with integrated getter

Technical features:

  • 60µm or 80µm thick single crystal silicon structures
  • DRIE with High Aspect Ratio up to 1:30
  • Hermetic Wafer Level Package with
    • Vacuum ❮10mTorr with getter for stable Q factor of 10s of thousands
    • Atmospheric pressure for damped structures
  • 2 metal layers on cap for electrodes and routing with crossing
  • Lateral vias for side-by-side or stacked-dies wire-bonding assembly
  • 100% static and dynamic test including frequency and Q Factor tests

By using our Magelan foundry platform, customers benefit from:


To know more download our brochure or contact us